Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning

Title:
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning
Creator:
Park, Jin-Goo (Author)
Lee, Sang-Ho (Author)
Ryu, Ju-Suk (Author)
Hong, Yi-Koan (Author)
Kim, Tae-Gon (Author)
Busnaina, Ahmed A. (Author)
Language:
English
Publisher:
The Electrochemical Society
Copyright date:
20062006
Type of resource:
Text
Genre:
Articles
Format:
electronic
Digital origin:
born digital
Abstract/Description:
In this study, the interfacial and electrokinetic phenomena of mixtures of isopropyl alcohol (IPA) and deionized (DI) water in relation to semiconductor wafer drying is investigated. The dielectric constant of an IPA solution linearly decreased from 78 to 18 with the addition of IPA to DI water. The viscosity of IPA solutions increased as the volume percentage of IPA in DI water increased. The zeta potentials of silica particles and silicon wafers were also measured in IPA solutions. The zeta potential approached neutral values as the volume ratio of IPA in DI water increased. A surface tension decrease from 72 to 23 dynes/cm was measured when the IPA concentration increased to 30 vol %. The surface excess of IPA at the air-liquid interface reached a maximum at around 20 vol % IPA. The adhesion forces of silica particles on silicon wafers were measured using atomic force microscopy in IPA solutions. The adhesion force increased as the volume percent of IPA in water increased. Lower particulate contamination was observed when the wafers were immersed and withdrawn from solutions containing less than 25 vol % IPA.
Comments:
Originally published in Journal of the Electrochemical Society, v.153, no.9, pp. G811-G814 (2006). doi:10.1149/1.2214532
Subjects and keywords:
Semiconductor wafers
silicon
surface cleaning
silicon compounds
organic compounds
water
elemental semiconductors
insulating materials
solutions
liquid mixtures
electrokinetic effects
drying
permittivity
viscosity
surface tension
chemical analysis
adhesion
atomic force microscopy
Electronic Devices and Semiconductor Manufacturing
Nanoscience and Nanotechnology
Permanent Link:
http://hdl.handle.net/2047/d20000926

Downloads